2026.05.19 新微
GaN on SiC HEMT (1) 14 mask steps (2) MPW: deferent designs in the same step light stamp, if the chips are of different sizes, it is hard to dice, so better the use the same chip size for different designs, losing some wafer estate. (3) The cost of making a set of masks costs around RMB 100,000, for a glass mask with 4 layers on the same substrate. It takes about 1 week to make the masks by XiWei. Tape out of a wafer takes about slightly less than 2 months and costs about RMB 100,000.
2026.05.19 新微
GaN on SiC HEMT (1) 14 mask steps (2) MPW: deferent designs in the same step light stamp, if the chips are of different sizes, it is hard to dice, so better the use the same chip size for different designs, losing some wafer estate. (3) The cost of making a set of masks costs around RMB 100,000, for a glass mask with 4 layers on the same substrate. It takes about 1 week to make the masks by XiWei. Tape out of a wafer takes about slightly less than 2 months and costs about RMB 100,000.
分化的“易中天”，光模块的新变 2025 Q1-Q3 财务分析:
https://baijiahao.baidu.com/s?id=1847720252364069766&wfr=spider&for=pc
砷化镓GaAs HBT产业链与射频PA 2022
https://mp.weixin.qq.com/s?__biz=MzIwODc4NzE1OA==&mid=2247507697&idx=1&sn=8892a8f5519a1cb29a3e54401f2cfa22&chksm=977f5d48a008d45e5e1c29d7a12cccb797cf7fd9ed5370d1749d49e131ccd2584d6694e52099&scene=27